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Off-Line, High Brightness LED Driver
Features
* 8VDC to 450VDC Input Voltage Range * >90% Efficiency * Drives Multiple LEDs in Series/Parallel Combinations * Regulated LED Drive Current * Linear or PWM Brightness Control * Resistor-Programmable Oscillator Frequency * RoHS Compliant
MXHV9910
Description
The MXHV9910 is a low-cost, high-brightness (HB) LED driver manufactured using Clare's high-voltage BCDMOS on SOI process. This driver has internal circuitry that allows it to operate from a universal AC line or from 8VDC to 450VDC. This highly versatile input operating voltage enables this IC to be used in a broad range of HB LED applications. The driver features a fixed-frequency, peak-current control method, which provides an ideal solution for driving multiple LEDs in series and in parallel. In addition, LED dimming can be implemented by applying a small DC voltage to the LD pin, or by applying a low-frequency digital PWM signal to the PWMD pin. The MXHV9910 is available in a standard 8-lead SOIC package and a thermally enhanced 8-lead SOIC package with an Exposed Thermal Pad (EP)
Applications
* Flat-Panel Display RGB Backlighting * Signage and Decorative LED Lighting * DC/DC or AC/DC LED Driver Applications
Ordering Information
Part Description SOIC-8 (100/Tube) SOIC-8 Tape & Reel (2000/Reel) SOIC-8 EP (100/Tube) With Exposed Thermal Pad SOIC-8 EP Tape & Reel (2000/Reel) With Exposed Thermal Pad
Pb
RoHS
2002/95/EC
e3
MXHV9910B MXHV9910BTR MXHV9910BE MXHV9910BETR
Block Diagram
VDD VIN 6 1
Voltage Reference 250mV Voltage Regulator
RT
8
OSC
+
PWM Control
4
GATE
LD PWMD GND
7 5 3
+
2
CS
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MXHV9910
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Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1 Package Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.6 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.2 LED Driver Theory of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.2.1 Input Voltage Regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.2.2 Current Sense Resistor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.2.3 Current Sense Blanking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.2.4 Enable/Disable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.2.5 Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.2.6 Inductor Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.2.7 Gate Output Drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.2.8 Linear Dimming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.2.9 PWM Dimming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.2.10 Combination Linear and PWM Dimming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1 Mechanical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2 Packaging Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2.1 Tape & Reel Information for both 8-Pin Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.3 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.4 Washing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3 3 3 3 4 4 4 5 5 5 6 6 7 7 7 7 8 8 8 9
2
3
10 10 11 11 11 11
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MXHV9910 1. Specifications
1.1 Package Pinout 1.2 Pin Description
Pin#
1 2 3 4 5 6
Name
VIN CS GND GATE PWMD VDD LD RT Input voltage
Description
LED Current Sense input. Internal current sense threshold is set at 250mV. The external sense resistor sets the maximum LED current. Device Ground External MOSFET gate driver output Low-frequency PWM dimming control input with internal pull-down resistor. Regulated supply voltage output. Requires a storage capacitor to GND. Can be overdriven by external voltage applied to VDD. Linear Dimming. Apply a voltage less than VCS(high) to dim the LED(s). Resistor to GND sets the oscillator/primary PWM frequency. Electrical and thermal conductive pad on the bottom of the MXHV9910BE. Connect this pad to ground, and provide sufficient thermal coupling to remove heat from the package.
VIN CS GND GATE
1 2 3 4
8 7 6 5
RT LD VDD PWMD
7 8
EP
-
1.3 Absolute Maximum Ratings
Parameter Input Voltage to GND Inputs & Outputs Voltage to GND VDD , Externally Applied Power Dissipation SOIC-8 With Thermal Tab SOIC-8 W/O Thermal Tab Maximum Junction Temperature Operating Temperature Junction Temperature (Operating) Storage Temperature PD TJmax TA TJ TSTG 2.5 0.975 150 -40 to +85 -40 to +150 -55 to +150 W W C C C C Symbol VIN CS, LD, PWMD, GATE VDD.EXT Maximum -0.5 to +460 -0.3 to VDD+0.3 15 Unit V V V
Electrical absolute maximum ratings are at 25C.
Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied.
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1.4 Recommended Operating Conditions
Parameter Input Voltage Range PWMD Frequency Operating Temperature Symbol VIN fPWMD TA Minimum 8 -40 Nominal 500 Maximum 450 +85 Unit VDC Hz C
1.5 Electrical Characteristics
Unless otherwise specified, all electrical specifications are provided for TA=25C. Parameter Input Input DC Voltage Range Shut-Down Mode Supply Current Maximum Voltage to VDD Pin Regulator Internal Voltage Regulator VDD Current Available for External Circuitry VDD Load Regulation PWM Dimming PWMD Input Low Voltage PWMD Input High Voltage PWMD Pull-Down Resistance Current Sense Comparator Current Sense (CS) Input Current CS Low CS High Current Sense Threshold Voltage Current Sense Blanking Interval Delay from CS Trip to Gate Low Oscillator Oscillator Frequency (Gate Driver) Gate Driver Gate High Output Voltage Gate Low Output Voltage Gate Output Rise Time Gate Output Fall Time Conditions DC Input Voltage PWMD to GND, VIN=15 to 450V External Voltage applied to VDD Pin VIN=15V to 450V, IDD(ext)=0, GATE Output=Open VIN=15V, IL=1mA VIN=8V to 450V VIN=8V to 450V VIN=12V, VPWMD=VDD Symbol VIN IINSD VDDmax Minimum 8 Typical 0.3 Maximum 450 0.6 12 Unit VDC mA V
VDD IDD(ext) VDD VEN(low) VEN(high) REN
7.2 2.4 70
7.8 115
8.4 2 200 0.5 150
VDC mA mV V k
CS=0V CS=VDD -40C < TA < 85C RT=400k RT=400k RT=400k IOUT= -10mA IOUT=10mA CGATE=500pF CGATE=500pF
IIL IIH VCS(high) tBLANK tDELAY fS VGATE(hi) VGATE(lo) tRISE tFALL
200 51 VDD-0.3 -
-45 0 400 300 64 0.03 16 7
-90 15 280 77 0.3 -
A mV ns ns kHz V ns
1.6 Thermal Characteristics
Parameter Thermal Resistance, Junction-to-Ambient
1
Package SOIC-8 With Thermal Pad (BE) 1 SOIC-8 W/O Thermal Pad (B)
Symbol RJA
Minimum -
Typical 50 128
Maximum -
Unit C/W
Use of a four-layer PCB can improve thermal dissipation (reference EIA/JEDEC JESD51-5).
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MXHV9910 2. Functional Description
Figure 1 Typical Application Circuit
8-450V
VDD
6 1
VDD VIN
Voltage Reference 250mV Voltage Regulator
8
RT
OSC
+
PWM Control
GATE
4
7 5 3
LD
+
PWMD GND CS
2
RSENSE
2.1 Overview
The MXHV9910 is a high-efficiency, low cost, off-line LED driver designed using Clare's state of the art BCDMOS on SOI process. The driver can operate from a DC supply voltage between 8 to 450VDC . The versatile input supply voltage range enables this driver to be used in a broad range of applications such as flat panel display RGB backlighting, signage, decorative LED lighting, and incandescent lamp replacement. The MXHV9910 IC is configured in a buck converter topology, which is a perfect choice for off-line and DC applications driving multiple LEDs in series or parallel. This method provides excellent efficiency and enables a buck switcher design using a minimum number of external components. An external current sense resistor sets the peak current to the LED string. In addition, LED dimming can be implemented by either applying a DC control voltage to the LD pin, or by applying a low frequency, pulse-width modulated digital signal to the PWMD pin (typically 500 Hz).
located at the CS pin. When the rising voltage at the current sense, CS, pin exceeds VCS(high), the internally set threshold, the gate drive signal goes low and turns off the external power MOSFET. Turning the power MOSFET off causes the inductor current to decay until the next rising edge of the clock, and the process repeats. The peak current threshold is set by comparing the voltage developed across the RSENSE resistor to the internal threshold, VCS(high). This default threshold can be overridden externally by applying a voltage less than VCS(high) to the LD pin. The lower of these two thresholds limits the peak current in the inductor A soft-start function can be implemented by slowly ramping up the DC voltage at the LD pin from 0mV to a level greater than 250mV. Figure 2 shows a typical recommended soft-start circuit design. Figure 2 Soft-Start RC Network
MXHV9910 51k
2.2 LED Driver Theory of Operation
The gate driver pulse width mode (PWM) control circuit is enabled by connecting the PWMD pin to the VDD pin. When enabled, the rising edge of each internal clock turns on the gate driver and the external power MOSFET, causing the inductor current to ramp up the voltage across the current sense resistor
R01
VIN CS GND GATE
RT LD VDD PWMD 2k 0.1F
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MXHV9910
Figure 3 MXHV9910 Waveforms (From Application Circuit in Figure 6)
Time Scale: 5s/div
CH1: 50mA/div FS 65kHz Max 77mA CH2: 10V/div CH3: 5mV/div x 10
2.2.1 Input Voltage Regulator The MXHV9910 has an internal voltage regulator that can work with input voltages ranging from 12VDC to 450 VDC. When the input voltage applied at the VIN pin is greater than 12VDC , the internal voltage regulator regulates this voltage down to a typical 7.8V. The VDD pin is the internal regulator output pin and must be bypassed by a low ESR capacitor, typically 0.1F, to provide a low impedance path for high frequency switching noise. The MXHV9910 driver does not require the bulky start-up resistors typically needed for off-line controllers. An internal voltage regulator provides sufficient voltage and current to power the internal IC circuits. This voltage is also available at the VDD pin, and can be used as bias voltage for external circuitry. The internal voltage regulator can by bypassed by applying an external DC voltage to the VDD pin that is slightly higher than the internal regulator's maximum output voltage. This feature reduces power dissipation of the integrated circuit and is more suitable in isolated applications where an auxiliary transformer winding could be used to supply VDD . The total input current drawn by the VIN pin is equal to the integrated circuit quiescent current, which is 0.6mA maximum, plus the gate driver current. The gate driver current is dependant on the switching frequency and the gate charge of the external power MOSFET.
The following equation can be used to approximate the VIN input current:
I IN 0.6mA + ( Q GATE x f S )
Where QGATE is the total gate charge of the external power MOSFET, and fS is the switching oscillator frequency. 2.2.2 Current Sense Resistor The peak LED current is set by an external current sense resistor connected from the CS pin to ground. The value of the current sense resistor is calculated based on the desired average LED current, the current sense threshold, and the inductor ripple current. The inductor is typically selected to be large enough to keep the ripple current (the peak-to-peak difference in the inductor current waveform) to less than 30% of the average LED current. Factoring in this ripple current requirement, the current sense resistor can be determined by:
V csth R sense = ------------------------------------------------------------[ 1 + ( 0.5 x r iout ) ] x I LED
Where: * Vcsth = nominal current sense threshold = 0.25V * riout = inductor ripple = 0.3 * ILED = average LED current The power dissipation rating of the sense resistor can be found with the following formula:
P = I LED x R sense
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It is a good practice to select a power rating that is at least twice the calculated value. This will give proper margins, and make the design more reliable. 2.2.3 Current Sense Blanking The MXHV9910 has an internal current-sense blanking circuit. When the power MOSFET is turned on, the external inductor can cause an undesired spike at the current sense pin, CS, initiating a premature termination of the gate pulse. To avoid this condition, a typical 400ns internal leading edge blanking time is implemented. This internal feature eliminates the need for external RC filtering, thus simplifying the design. During the current sense blanking time, the current limit comparator is disabled, preventing the gate-drive circuit from terminating the gate-drive signal. 2.2.4 Enable/Disable Connecting the PWMD pin to VDD enables the gate driver. Connecting PWMD to GND disables the gate driver and sets the device into the shut-down mode. In the shut-down mode, the gate output drive is disabled while all other functions remain active. The maximum quiescent current in the shut-down mode is 0.6mA. 2.2.5 Oscillator The MXHV9910 operates in a constant frequency mode. Setting the oscillator frequency is achieved by connecting an external resistor between RT and GND. In general, switching frequency selection is based on the inductor size, controller power dissipation, and the input filter capacitor. The typical off-line LED driver switching frequency, fS, is between 30kHz and 120kHz. This operating range gives designers a reasonable compromise between switching losses and inductor size. The internal RC oscillator has a frequency accuracy of 20%. Figure 4 shows the RT resistor selection for the desired fS. Where: * VLEDstring is the LED string voltage at desired average LED current. * Vin is the minimum input voltage to VIN
200
Figure 4 Resistor Selection
Oscillator Frequency, fS, vs. RT (TA=27C)
250
Frequency (kHz)
150
100
50
0 0 200 400 600 800 1000 1200
RT (k)
2.2.6 Inductor Design The inductor value is determined based on LED ripple current, maximum on-time, the forward voltage drop of all LEDs in a string at the desired current, and the minimum input voltage, which is based on design requirements. The maximum on-time is determined by the duty cycle and switching frequency. The maximum duty cycle is given by:
V LEDstring D max = ------------------------V in
The maximum duty cycle must be restricted to less than 50% in order to prevent sub-harmonic oscillations and open loop instability. The converter maximum ON-time is given by:
D max t ONmax = -----------fs
Where fs is the switching frequency of the internal oscillator. The inductor value for the given ripple is:
( V in - V LEDstring ) x t ONmax L min = -------------------------------------------------------------------r iout x I LED
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The inductor peak current rating is given by:
I Lmax = I LED x [ 1 + ( 0.5 x r iout ) ]
2.2.8 Linear Dimming A linear dimming function can be implemented by applying a DC control voltage to the LD pin. By varying this voltage, the user can adjust the current level in the LEDs, which in turn will increase or decrease the light intensity. The control voltage to the LD pin can be generated from an external voltage divider network from VDD . This function is useful if the user requires a LED current at a particular level and there is no exact Rsense value available. Note that applying a voltage higher than the current sense threshold voltage at the LD pin will not change the output current due to the fixed threshold setting. When the LD pin is not used, it should be connected to VDD .
2.2.7 Gate Output Drive The MXHV9910 uses an internal gate drive circuit to turn on and off an external power MOSFET. The gate driver can drive a variety of MOSFETs. For a typical off-line application, the total MOSFET gate charge will be less than 25nC.
Figure 5 Typical Linear Dimming Application Circuit
Fuse F2 2A BR1 AC Input 90 - 265Vrms NTC1 AC AC LD Monitor
+ C1 0.1F 400V C1 22F 400V R1 402k MXHV9910 VIN CS GND GATE IXTA8N50P C1 2.2F 16V C1 0.1F 25V RT LD VDD PWMD R2 51k RA1 5.0k
D1 BYV26B
HB LEDs 350mA
L1 4.7mH
R4 0.56
2.2.9 PWM Dimming Pulse width modulation dimming can be implemented by driving the PWMD pin with a low frequency square wave signal in the range of a few hundred Hertz. The PWMD signal controls the LED brightness by gating the PWM gate driver output pin GATE. The signal can be generated by a microcontroller or a pulse generator with a duty cycle proportional to the amount of desired light output. When PWMD is low, gate drive is off; when PWMD is high, gate drive is enabled.
Figure 6 Buck Driver for PWM Dimming Application Circuit
D1 Schottky 40V 10F 50V HB LEDs 900mA Max ASMT-Mx00 MXHV9910 VIN CS GND GATE RT LD VDD PWMD CPC1001N* 0.1F 50V *Optional Isolation PWM 402k
VIN 12 - 30VDC
220H
Q1
R1 0.27
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2.2.10 Combination Linear and PWM Dimming A combination of linear and PWM dimming techniques can be used to achieve a large dimming ratio. Note: The output current will not go to zero if the LD pin is pulled to GND because the minimum gate driver on-time is equal to the current sense blanking interval. To achieve zero LED current, the PWMD pin should be used.
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MXHV9910 3. Manufacturing Information
3.1 Mechanical Dimensions
8-Pin SOIC Package
0.19 - 0.25 (0.008 - 0.010)
Recommended PCB Land Pattern
1.55 (0.061) 0.40 - 1.27 (0.016 - 0.050) 5.40 (0.213) 1.27 TYP (0.05 TYP) 0.60 (0.024) 0.10 - 0.25 (0.004 - 0.010) 1.35 - 1.75 (0.053 - 0.069) Dimensions mm (inches) 1.27 (0.050)
5.80 - 6.20 (0.23 - 0.24) PIN 1 0.33 - 0.51 (0.013 - 0.020) 4.80 - 5.00 (0.19 - 0.20)
3.80 - 4.00 (0.15 - 0.16)
0.394 - 0.648 (0.016 - 0.026)
8-Pin SOIC Package with Exposed Thermal Pad
0.19 - 0.25 (0.008 - 0.010)
Recommended PCB Land Pattern
1.55 (0.061) 0.40 - 1.27 (0.016 - 0.050) 2.40 (0.09) 5.40 (0.213) 2.40 (0.09)
5.80 - 6.20 (0.23 - 0.24) PIN 1 0.33 - 0.51 (0.013 - 0.020)
3.80 - 4.00 (0.15 - 0.16)
1.27 TYP (0.05 TYP) 2.032 - 2.413 (0.080 - 0.095) 0.60 (0.024) 1.27 (0.050)
4.80 - 5.00 (0.19 - 0.20) 0.00 - 0.13 (0.000 - 0.005) 1.35 - 1.75 (0.053 - 0.069) Dimensions mm (inches)
0.394 - 0.648 (0.016 - 0.026)
2.032 - 2.413 (0.080 - 0.095)
Note: Thermal pad should be electrically connected to GND, pin 3.
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3.2 Packaging Information
3.2.1 Tape & Reel Information for both 8-Pin Packages
330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.)
W = 12.00 0.30 (0.472 0.012) B0 = 5.30 0.10 (0.209 0.004) Top Cover Tape
Embossed Carrier
P = 8.00 0.10 (0.315 0.004) K0= 2.10 0.10 (0.083 0.004) User Direction of Feed
A0 = 6.50 0.10 (0.256 0.004)
Embossment
Dimensions mm (inches)
NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2
3.3 Soldering
For proper assembly, this component must be processed in accordance with the current revision of IPC/JEDEC standard J-STD-020. Failure to follow the recommended guidelines may cause permanent damage to the device resulting in impaired performance and/or a reduced lifetime expectancy.
3.4 Washing
Clare does not recommend ultrasonic cleaning of this part.
Pb
RoHS
2002/95/EC
e3
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Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses or indemnity are expressed or implied. Except as set forth in Clare's Standard Terms and Conditions of Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty relating to its products, including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized, or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of Clare's product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice. Specifications: DS-MXHV9910-R01 (c) Copyright 2009, Clare, Inc. All rights reserved. Printed in USA. 7/22/09
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